Semiconductor module



FIG. 1 is a top, front and right side perspective view of thesemiconductor module showing my new design;

FIG. 2 is a back side elevational view thereof;

FIG. 3 is a front side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof; and,

FIG. 6 is a top plan view thereof.

The broken line portion of the figure drawings is included to showportions of the article that form no part of the claimed design.

All surfaces not shown form no part of the claimed design.

CLAIM The ornamental design for a semiconductor module, as shown anddescribed.